minor code cleanup

pcbnew/class_pad.cpp

@@ -31,9 +31,7 @@ D_PAD::D_PAD( MODULE* parent ) : BOARD_CONNECTED_ITEM( parent, TYPE_PAD )
     m_PadShape = PAD_CIRCLE;            // Shape: PAD_CIRCLE, PAD_RECT PAD_OVAL PAD_TRAPEZOID
     m_Attribut = PAD_STANDARD;          // Type: NORMAL, PAD_SMD, PAD_CONN
     m_DrillShape   = PAD_CIRCLE;        // Drill shape = circle
-    // these layers are ok for a standard pad:
-    m_Masque_Layer = ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP |\
-                SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP;
+    m_Masque_Layer = PAD_STANDARD_DEFAULT_LAYERS;   // set layers mask to default for a standard pad
 
     SetSubRatsnest( 0 );                // used in ratsnest calculations
     ComputeRayon();

pcbnew/class_pad.h

@@ -6,6 +6,21 @@ class Pcb3D_GLCanvas;
 
 #include "pad_shapes.h"
 
+/* Default layers used for pads, accordint to the pad type.
+ * this is default values only, they can be changed for a given pad
+ */
+// PAD_STANDARD:
+#define PAD_STANDARD_DEFAULT_LAYERS ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
+
+// PAD_CONN:
+#define PAD_CONN_DEFAULT_LAYERS CMP_LAYER | SOLDERPASTE_LAYER_CMP | SOLDERMASK_LAYER_CMP
+
+// PAD_SMD:
+#define PAD_SMD_DEFAULT_LAYERS CMP_LAYER | SOLDERMASK_LAYER_CMP
+
+//PAD_HOLE_NOT_PLATED:
+#define PAD_HOLE_NOT_PLATED_DEFAULT_LAYERS CUIVRE_LAYER | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
+
 
 /* Definition type Structure d'un pad */
 class D_PAD : public BOARD_CONNECTED_ITEM

pcbnew/dialog_pad_properties.cpp

@@ -31,16 +31,16 @@ int CodeType[NBTYPES] =
 static long Std_Pad_Layers[NBTYPES] =
 {
     // PAD_STANDARD:
-    ALL_CU_LAYERS | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP,
+    PAD_STANDARD_DEFAULT_LAYERS,
 
     // PAD_CONN:
-    CMP_LAYER | SOLDERPASTE_LAYER_CMP | SOLDERMASK_LAYER_CMP,
+    PAD_CONN_DEFAULT_LAYERS,
 
     // PAD_SMD:
-    CMP_LAYER | SOLDERMASK_LAYER_CMP,
+    PAD_SMD_DEFAULT_LAYERS,
 
     //PAD_HOLE_NOT_PLATED:
-    CUIVRE_LAYER | SILKSCREEN_LAYER_CMP | SOLDERMASK_LAYER_CU | SOLDERMASK_LAYER_CMP
+    PAD_HOLE_NOT_PLATED_DEFAULT_LAYERS
 };