minor maintainability improvements (6245ac52) · Commits · Elphel / kicad-source-mirror

change_log.txt

+1 −1

Original line number	Original line	Diff line number	Diff line
	@@ -9,7 +9,7 @@ email address.
	================================================================================		================================================================================
	+ pcbnew		+ pcbnew
	Added dedicated Show() function for SEGVIA. Enhanced BOARD_ITEM::MenuText()		Added dedicated Show() function for SEGVIA. Enhanced BOARD_ITEM::MenuText()
	for SEGVIA. Added to todo.txt.		for SEGVIA.


	2007-Sep-29 UPDATE Dick Hollenbeck <dick@softplc.com>		2007-Sep-29 UPDATE Dick Hollenbeck <dick@softplc.com>

include/pcbstruct.h

+41 −40

Original line number	Original line	Diff line number	Diff line
	@@ -34,46 +34,6 @@
	#define CHAIN 0x01 /* segment marque */		#define CHAIN 0x01 /* segment marque */


	/*************************************/
	/* constantes de gestion des couches */
	/*************************************/
	#define CUIVRE_LAYER 0x00000001 /* Bit layer cuivre */
	#define LAYER_2 0x00000002 /* Bit layer 2 */
	#define LAYER_3 0x00000004 /* Bit layer 3 */
	#define LAYER_4 0x00000008 /* Bit layer 4 */
	#define LAYER_5 0x00000010 /* Bit layer 5 */
	#define LAYER_6 0x00000020 /* Bit layer 6 */
	#define LAYER_7 0x00000040 /* Bit layer 7 */
	#define LAYER_8 0x00000080 /* Bit layer 8 */
	#define LAYER_9 0x00000100 /* Bit layer 9 */
	#define LAYER_10 0x00000200 /* Bit layer 10 */
	#define LAYER_11 0x00000400 /* Bit layer 11 */
	#define LAYER_12 0x00000800 /* Bit layer 12 */
	#define LAYER_13 0x00001000 /* Bit layer 13 */
	#define LAYER_14 0x00002000 /* Bit layer 14 */
	#define LAYER_15 0x00004000 /* Bit layer 15 */
	#define CMP_LAYER 0x00008000 /* Bit layer cmp */
	#define ADHESIVE_LAYER_CU 0x00010000
	#define ADHESIVE_LAYER_CMP 0x00020000
	#define SOLDERPASTE_LAYER_CU 0x00040000
	#define SOLDERPASTE_LAYER_CMP 0x00080000
	#define SILKSCREEN_LAYER_CU 0x00100000
	#define SILKSCREEN_LAYER_CMP 0x00200000
	#define SOLDERMASK_LAYER_CU 0x00400000
	#define SOLDERMASK_LAYER_CMP 0x00800000
	#define DRAW_LAYER 0x01000000
	#define COMMENT_LAYER 0x02000000
	#define ECO1_LAYER 0x04000000
	#define ECO2_LAYER 0x08000000
	#define EDGE_LAYER 0x10000000
	// extra bits 0xE0000000
	/* masques generaux : */
	#define ALL_LAYERS 0x1FFFFFFF
	#define ALL_NO_CU_LAYERS 0x1FFF0000
	#define ALL_CU_LAYERS 0x0000FFFF
	#define INTERNAL_LAYERS 0x00007FFE /* Bits layers internes */
	#define EXTERNAL_LAYERS 0x00008001

	/* Flags pour les couches cuivres */		/* Flags pour les couches cuivres */
	/* numero des couches particulieres */		/* numero des couches particulieres */
	#define LAYER_CUIVRE_N 0		#define LAYER_CUIVRE_N 0
	@@ -115,6 +75,47 @@

	#define LAYER_COUNT 32		#define LAYER_COUNT 32


			/*************************************/
			/* constantes de gestion des couches */
			/*************************************/
			#define CUIVRE_LAYER (1<<LAYER_CUIVRE_N) ///< bit mask for copper layer
			#define LAYER_2 (1<<LAYER_N_2) ///< bit mask for layer 2
			#define LAYER_3 (1<<LAYER_N_3) ///< bit mask for layer 3
			#define LAYER_4 (1<<LAYER_N_4) ///< bit mask for layer 4
			#define LAYER_5 (1<<LAYER_N_5) ///< bit mask for layer 5
			#define LAYER_6 (1<<LAYER_N_6) ///< bit mask for layer 6
			#define LAYER_7 (1<<LAYER_N_7) ///< bit mask for layer 7
			#define LAYER_8 (1<<LAYER_N_8) ///< bit mask for layer 8
			#define LAYER_9 (1<<LAYER_N_9) ///< bit mask for layer 9
			#define LAYER_10 (1<<LAYER_N_10) ///< bit mask for layer 10
			#define LAYER_11 (1<<LAYER_N_11) ///< bit mask for layer 11
			#define LAYER_12 (1<<LAYER_N_12) ///< bit mask for layer 12
			#define LAYER_13 (1<<LAYER_N_13) ///< bit mask for layer 13
			#define LAYER_14 (1<<LAYER_N_14) ///< bit mask for layer 14
			#define LAYER_15 (1<<LAYER_N_15) ///< bit mask for layer 15
			#define CMP_LAYER (1<<LAYER_CMP_N) ///< bit mask for component layer
			#define ADHESIVE_LAYER_CU (1<<ADHESIVE_N_CU)
			#define ADHESIVE_LAYER_CMP (1<<ADHESIVE_N_CMP)
			#define SOLDERPASTE_LAYER_CU (1<<SOLDERPASTE_N_CU)
			#define SOLDERPASTE_LAYER_CMP (1<<SOLDERPASTE_N_CMP)
			#define SILKSCREEN_LAYER_CU (1<<SILKSCREEN_N_CU)
			#define SILKSCREEN_LAYER_CMP (1<<SILKSCREEN_N_CMP)
			#define SOLDERMASK_LAYER_CU (1<<SOLDERMASK_N_CU)
			#define SOLDERMASK_LAYER_CMP (1<<SOLDERMASK_N_CMP)
			#define DRAW_LAYER (1<<DRAW_N)
			#define COMMENT_LAYER (1<<COMMENT_N)
			#define ECO1_LAYER (1<<ECO1_N)
			#define ECO2_LAYER (1<<ECO2_N)
			#define EDGE_LAYER (1<<EDGE_N)
			// extra bits 0xE0000000
			/* masques generaux : */
			#define ALL_LAYERS 0x1FFFFFFF
			#define ALL_NO_CU_LAYERS 0x1FFF0000
			#define ALL_CU_LAYERS 0x0000FFFF
			#define INTERNAL_LAYERS 0x00007FFE /* Bits layers internes */
			#define EXTERNAL_LAYERS 0x00008001

	/* Forme des segments (pistes, contours ..) ( parametre .shape ) */		/* Forme des segments (pistes, contours ..) ( parametre .shape ) */
	enum Track_Shapes {		enum Track_Shapes {
	S_SEGMENT = 0, /* segment rectiligne */		S_SEGMENT = 0, /* segment rectiligne */

pcbnew/class_track.cpp

+11 −5

Original line number	Original line	Diff line number	Diff line
	@@ -214,15 +214,19 @@ int TRACK::ReturnMaskLayer()
	{		{
	if( Type() == TYPEVIA )		if( Type() == TYPEVIA )
	{		{
	int via_type = m_Shape & 15;		int via_type = Shape();

	if( via_type == VIA_NORMALE )		if( via_type == VIA_NORMALE )
	return ALL_CU_LAYERS;		return ALL_CU_LAYERS;

	// VIA_BORGNE ou VIA_ENTERREE:		// VIA_BORGNE ou VIA_ENTERREE:
	int bottom_layer = (m_Layer >> 4) & 15;
	int top_layer = m_Layer & 15;		int bottom_layer;
	if( bottom_layer > top_layer )		int top_layer;
	EXCHG( bottom_layer, top_layer );
			// ReturnLayerPair() knows how layers are stored
			((SEGVIA*)this)->ReturnLayerPair( &top_layer, &bottom_layer );

	int layermask = 0;		int layermask = 0;
	while( bottom_layer <= top_layer )		while( bottom_layer <= top_layer )
	{		{
	@@ -272,8 +276,10 @@ void SEGVIA::ReturnLayerPair( int* top_layer, int* bottom_layer ) const

	if( b_layer > t_layer )		if( b_layer > t_layer )
	EXCHG( b_layer, t_layer );		EXCHG( b_layer, t_layer );

	if( top_layer )		if( top_layer )
	*top_layer = t_layer;		*top_layer = t_layer;

	if( bottom_layer )		if( bottom_layer )
	*bottom_layer = b_layer;		*bottom_layer = b_layer;
	}		}

pcbnew/class_track.h

+8 −0

Original line number	Original line	Diff line number	Diff line
	@@ -96,8 +96,16 @@ public:
	/* divers */		/* divers */
	int Shape() const { return m_Shape & 0xFF; }		int Shape() const { return m_Shape & 0xFF; }

			/**
			* Function ReturnMaskLayer
			* returns a "layer mask", which is a bitmap of all layers on which the
			* TRACK segment or SEGVIA physically resides.
			* @return int - a layer mask, see pcbstruct.h's CUIVRE_LAYER, etc.
			*/
	int ReturnMaskLayer();		int ReturnMaskLayer();

	int IsPointOnEnds( const wxPoint& point, int min_dist = 0 );		int IsPointOnEnds( const wxPoint& point, int min_dist = 0 );

	bool IsNull(); // return TRUE if segment lenght = 0		bool IsNull(); // return TRUE if segment lenght = 0

todo.txt

+0 −2

Original line number	Original line	Diff line number	Diff line
	@@ -51,5 +51,3 @@ understanding by new developers.
	*** Implement the graying in/out of "Edit/Undo", "Edit/Redo" menu items,		*** Implement the graying in/out of "Edit/Undo", "Edit/Redo" menu items,
	when Undo/Redo stack is empty/filled.		when Undo/Redo stack is empty/filled.

	*** There is no way to truly edit a via, such as changing its layers.

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