Headings:
12 auxiliary technical layers.
Some are associated in pairs, others not. When they appear as a pair this affects the behaviour of modules. The elements making up a module (pads, drawing and text) appearing on a layer (solder or component), appear on the other complementary layer when the module is inverted (mirrored).
The Adhesives layers (Copper and
Component):
These are used in the
application of adhesive to stick SMD components to the circuit
board, generally before wave soldering.
The Solder Paste layers
paste SMD (Copper and Component):
Used
to produce a masks to allow solder paste to be placed on the pads of
surface mount components, generally before reflow soldering. In
theory only surface mount pads occupy these layers.
The Silk Screen layers (Copper and
Component):
They are the layers
where the drawings of the components appear.
The Solder Mask layers
(Copper and Component):
These
define the solder masks. Normally all the pads appear on one or the
other of these layers (or both for through pads) to prevent the
varnish covering the pads.
Layers for general use:
- Comments
-
E.C.O. 1
- E.C.O. 2
-
Drawings
Layer Edges PCB: this layer is reserved for the drawing of circuit board outline. Any element (graphic, texts…) placed on this layer appears on all the other layers.
Using the + and – keys (works on copper layers only).